In the field of edge computing and intelligent terminals, the Visual Big Data Research Center has continuously undertaken cooperation projects with universities such as Qualcomm's "integrated face analysis", "gaze and head posture detection", "face detection" and "human body part detection". We research and develop high-performance vision algorithms adapted to Snapdragon chips. We continuously undertook Huawei's cooperative development projects such as "Ascend Processor AI Model", "MindSpore Zongzhi Ascend 310 Reasoning" and "MindSpore ModelZoo Network", and completed ResNet_Inception_v2, MobileNet v3 large and other classic object classification networks, as well as SSD_ResNet50, FaceBoxes Transplantation and deployment of classic object detection such as MindArts, Ascend 910 and 310 platforms. The above models are widely used in smart terminals and edge devices equipped with Qualcomm Snapdragon and Huawei Ascend chips.

In the field of intelligent manufacturing, we undertake research and development projects such as "product packaging text detection and OCR recognition" and "SMT electronic material tray automatic counting", apply AI technology to the automatic text recognition of the packaging on the production line, and the delivery of SMT electronic spare parts. This technology greatly improves the production efficiency and saves labor costs after replacing manual work.